THERMOELECTRIC ELEMENT AND THERMOELECTRIC MODULE

摘要

Provided is a thermoelectric element. The thermoelectric element includes an insulation substrate, a semiconductor layer on the insulation substrate, insulation layers disposed on the semiconductor layer and spaced apart from each other in a first direction parallel with a surface of the insulation substrate, metal thin films disposed on the insulation layers, and metal-semiconductor compound layers between the semiconductor layer and the second parts. Each of the metal thin films includes a first part overlapping the insulation layer and a second part extending from the first part in the first direction or in a direction opposite to the first direction to be connected to the semiconductor layer, and the second parts facing each other in the metal thin films adjacent to each other are spaced apart from each other.

主权项

1. A thermoelectric element comprising:
an insulation substrate; a semiconductor layer on the insulation substrate; insulation layers disposed on the semiconductor layer and spaced apart from each other in a first direction parallel with a surface of the insulation substrate; metal thin films disposed on the insulation layers, wherein each of the metal thin films comprises a first part overlapping the insulation layer and a second part extending from the first part in the first direction or in a direction opposite to the first direction to be connected to the semiconductor layer; and metal-semiconductor compound layers between the semiconductor layer and the second parts, wherein the second parts facing each other in the metal thin films adjacent to each other are spaced apart from each other.