INTEGRATED MEMS-CMOS DEVICES AND INTEGRATED CIRCUITS WITH MEMS DEVICES AND CMOS DEVICES

摘要

Integrated MEMS-CMOS devices and integrated circuits with MEMS devices and CMOS devices are provided. An exemplary integrated MEMS-CMOS device is vertically integrated and includes a substrate having a first side and a second side opposite the first side. Further, the exemplary vertically integrated MEMS-CMOS device includes a CMOS device located in and/or over the first side of the substrate. Also, the exemplary vertically integrated MEMS-CMOS device includes a MEMS device located in and/or under the second side of the substrate.

主权项

1. An integrated circuit comprising:
a semiconductor substrate having a first side and an opposite second side; an interconnect extending through the first side of a semiconductor substrate; a dielectric layer overlying the first side of the semiconductor substrate; a CMOS device in or on the dielectric layer overlying the first side of the semiconductor substrate; a first conductive structure in the dielectric layer and in electrical contact with the interconnect; and a MEMS device under or on the second side of the semiconductor substrate and in electrical connection with the interconnect.