| 发明名称 |
PACKAGING ARRANGEMENTS INCLUDING HIGH DENSITY INTERCONNECT BRIDGE |
| 摘要 |
Embodiments provide a packaging arrangement that includes a high density interconnect bridge for interconnecting dies within the packaging arrangement. The packaging arrangement comprises one or more redistribution layers and an interconnect bridge embedded within the one or more redistribution layers. A first die is coupled to (i) a first portion of the one or more redistribution layers and (ii) a first portion of the interconnect bridge. A second die coupled to a (ii) a second portion of the one or more redistribution layers and (ii) a second portion of the interconnect bridge to electrically couple the first die and the second die via at least the first interconnect bridge. |
| 申请公布号 |
US2017125334(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615334188 |
申请日期 |
2016.10.25 |
| 申请人 |
Marvell World Trade Ltd. |
发明人 |
Wang Long-Ching;Zhang Lijuan;Sinai Ronen |
| 分类号 |
H01L23/498;H01L23/00;H01L21/56;H01L21/48;H01L25/00;H01L25/065;H01L23/31 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaging arrangement comprising:
one or more redistribution layers; an interconnect bridge embedded within the one or more redistribution layers; a first die coupled to (i) a first portion of the one or more redistribution layers and (ii) a first portion of the interconnect bridge; and a second die coupled to (ii) a second portion of the one or more redistribution layers and (ii) a second portion of the interconnect bridge to electrically couple the first die and the second die via at least the first interconnect bridge. |
| 地址 |
St. Michael BB |
