| 发明名称 |
POWER HEAT DISSIPATION DEVICE |
| 摘要 |
A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink. |
| 申请公布号 |
US2017120719(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201514981118 |
申请日期 |
2015.12.28 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHANG Po-Hua;WU Min-Chuan;CHIANG Wen-Shu;LIN Li-Song;LIN Kou-Tzeng |
| 分类号 |
B60H1/00 |
主分类号 |
B60H1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power heat dissipation device , comprising:
a heat-conducting layer having a heat-absorbing surface and a heat-dissipating surface; a heat sink in thermal contact with the heat-dissipating surface of the heat-conducting layer, and a heat-conducting section is formed in the heat sink; and at least one cooling chip embedded in the heat sink and disposed adjacent to the heat transferring channel, the at least one cooling chip having a cooling surface perpendicular to the heat-dissipating surface of the heat-conducting layer, and the cooling surface facing the heat-conducting section in the heat sink, the cooling chip removing heat from the heat-conducting section in the heat sink. |
| 地址 |
Hsinchu TW |
