| 发明名称 |
FRAME ELEMENTS FOR PACKAGE STRUCTURES COMPRISING PRINTED CIRCUIT BOARDS (PCBs) |
| 摘要 |
An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material. |
| 申请公布号 |
US2017127523(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201514928055 |
申请日期 |
2015.10.30 |
| 申请人 |
Avago Technologies General IP (Singapore) Pte. Ltd |
发明人 |
Fritz Martin;Gebauer Bernhard;Elbrecht Lueder;Handtmann Martin;Wiedenmann Oliver;Scherer Sergej |
| 分类号 |
H05K1/18;H05K1/11;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a substrate; an electronic component disposed over the substrate; a frame element disposed over the substrate, the frame element configured to provide structural rigidity to the apparatus; an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element; and an electrically conductive layer disposed over the encapsulating material. |
| 地址 |
Singapore SG |
