FINFET GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor device includes a n-type gate structure over a first semiconductor fin, in which the n-type gate structure is fluorine incorporated and includes a n-type work function metal layer overlying the first high-k dielectric layer. The n-type work function metal layer includes a TiAl (titanium aluminum) alloy, in which an atom ratio of Ti (titanium) to Al (aluminum) is in a range substantially from 1 to 3. The semiconductor device further includes a p-type gate structure over a second semiconductor fin, in which the p-type gate structure is fluorine incorporated includes a p-type work function metal layer overlying the second high-k dielectric layer. The p-type work function metal layer includes titanium nitride (TiN), in which an atom ratio of Ti to N (nitrogen) is in a range substantially from 1:0.9 to 1:1.1.

主权项

1. A semiconductor device, comprising:
a semiconductor substrate; a first semiconductor fin on the semiconductor substrate; and a n-type gate structure over the first semiconductor fin, wherein the n-type gate structure is fluorine incorporated and comprises:
a first initial layer over the first semiconductor fin;a first high-k dielectric layer over the first initial layer and enclosed by a first gate spacer;a n-type work function metal layer overlying the first high-k dielectric layer, the n-type work function metal layer comprising TiAl (titanium aluminum) alloy or TaAl (tantalum aluminum) alloy, wherein an atom ratio of Ti (titanium) to Al (aluminum) is in a range substantially from 1 to 3 when the n-type work function metal layer comprises the TiAl alloy;a first blocking metal layer overlying the n-type work function metal layer; and
a first metal filler peripherally enclosed by the first blocking metal layer, such that the first metal filler is enclosed by a first stacked structure, wherein a side wall of the first stacked structure contains a fluorine concentration substantially from 5 atom percent (at %) to 20 at %, and a bottom of the first stacked structure contains a fluorine concentration substantially from 1 at % to 15 at %.