发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE |
摘要 |
Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics. |
申请公布号 |
US2017121571(A1) |
申请公布日期 |
2017.05.04 |
申请号 |
US201515116081 |
申请日期 |
2015.02.13 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
NAMIKI Hidetsugu;KANISAWA Shiyuki;ISHIGAMI Akira;AOKI Masaharu |
分类号 |
C09J9/02;C09J11/04;H01L33/64;C09J163/00;C08K9/02;C08K3/22;H01L33/62;H01L33/60 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
1. An anisotropic conductive adhesive comprising:
conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle; solder particles having a smaller average particle diameter than the conductive particles; reflective insulating particles having a smaller average particle diameter than the solder particles; and a binder in which the conductive particles, the solder particles, and the reflective insulating particles are dispersed. |
地址 |
Tokyo JP |