| 摘要 |
PURPOSE:To provide the titled adhesive having excellent heat resistance, adhesion and electrical conductivity and suitable for use as an adhesive for IC chips, by using, as a main component, a polyimidine which is a specific heterocyclic polymer having carbon-to-carbon double bond in the molecule. CONSTITUTION:15-50pts.wt. polyimidine resin (A) of formulas I and/or II (wherein R1 is a group of formula III or IV; R2 is an arom. diamine), 100pts.wt. electrically conductive powder (B) (e.g. flaky silver powder having an average particle size of 5mu or spherical silver powder having an average particle size of 0.5mu) and 0.1-50pts.wt. solvent (C) (e.g. dimethylacetamide) are mixed together to obtain a heat-resistant electrically conductive adhesive. The adhesive is applied to a lead frame, etc. and calcined at 200-350 deg.C for 30-60min. After calcining, the adhesive exhibits good heat resistance and sufficient strength even when heated at 350 deg.C for 10min.
|
