发明名称 |
Bonding of composite materials |
摘要 |
Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure. |
申请公布号 |
US9636867(B2) |
申请公布日期 |
2017.05.02 |
申请号 |
US201414339905 |
申请日期 |
2014.07.24 |
申请人 |
CYTEC INDUSTRIES INC. |
发明人 |
MacAdams Leonard;Kohli Dalip |
分类号 |
B29C65/00;B32B7/06;B32B7/12;B32B27/38;B32B37/00;B32B37/12;B32B38/10;C08J5/24;C09J5/02;B29C65/48;B29C65/50;B29C65/02;C09J163/00;B32B5/02;B32B5/12;B32B38/00;B29C70/54 |
主分类号 |
B29C65/00 |
代理机构 |
|
代理人 |
Dang Thi |
主权项 |
1. A method for surface preparation prior to adhesive bonding comprising:
(a) providing a composite substrate comprising reinforcing fibers impregnated with a curable, first matrix resin; (b) applying a removable, resin-rich peel ply onto a surface of the composite substrate, said peel ply comprising a woven fabric impregnated with a curable, second matrix resin different from the first matrix resin; (c) co-curing the composite substrate and the peel ply until the composite substrate is fully cured but the second matrix resin in the peel ply remains partially cured; and (d) removing the peel ply from the composite substrate's surface, leaving a thin film of partially cured second matrix resin on the composite substrate's surface, said thin film providing a roughened, bondable surface with chemically-active functional groups. |
地址 |
Woodland Park NJ US |