Light emitting device and light emitting device array

摘要

A light emitting structure includes lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers. The light emitting structure is provided on the substrate. A first electrode layer provided on the upper semiconductor layer includes a first adhesive layer and a first bonding layer overlapping each other. A reflective layer is not provided between the first adhesive layer and the first bonding layer.

主权项

1. A light emitting device array, comprising:
a substrate; a plurality of light emitting devices spaced from one another in a horizontal direction on the substrate; a conductive interconnection layer to connect two light emitting devices among the plurality of light emitting devices; and a first insulating layer disposed between the light emitting devices and the conductive interconnection layer, wherein respective light emitting devices comprise:
a light emitting structure including lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers;a first electrode disposed on the upper semiconductor layer;a second electrode disposed on the lower semiconductor layer; anda current blocking layer disposed between the light emitting structure and the first electrode,wherein the conductive interconnection layer connects the first electrode of one of the two light emitting devices to the second electrode of the other of the two light emitting devices,wherein the first electrode includes a first adhesive layer and a first bonding layer overlapping each other,wherein a reflective layer is not disposed between the first adhesive layer and the first bonding layer,wherein the first adhesive layer is disposed to surround upper and side parts of the current blocking layer,wherein the conductive interconnection layer comprises a third adhesive layer and a third bonding layer overlapping each other, andwherein a reflective layer is not disposed between the third adhesive layer and the third bonding layer.