发明名称 Chip level sensor with multiple degrees of freedom
摘要 A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
申请公布号 US9638524(B2) 申请公布日期 2017.05.02
申请号 US201213690932 申请日期 2012.11.30
申请人 Robert Bosch GmbH 发明人 Feyh Ando;Chen Po-Jui
分类号 G01C19/5712;B81B7/02;G01P15/12;G01C19/5755;G01C19/5769;G01P15/125;G01C25/00;G01P15/08;G01P15/18 主分类号 G01C19/5712
代理机构 Maginot Moore & Beck LLP 代理人 Maginot Moore & Beck LLP
主权项 1. A sensing assembly device comprising: a substrate; a chamber above the substrate; a first piezoelectric gyroscope sensor positioned within the chamber; and a first accelerometer positioned within the chamber, wherein the chamber is pressurized to a pressure sufficient to provide damping for the first accelerometer; the first piezoelectric gyroscope comprises: a first and second support beam, each of the first and second support beams having a respective pair of piezoelectric drive elements; a first and second secondary support beams supported by the first support beam; a third and a fourth secondary support beam supported by the second support beam; a seismic mass supported by the first, second, third, and fourth secondary support beams; and four piezoelectric sense elements, each of the four piezoelectric sense elements located on a respective one of the first, second, third, and fourth secondary support beams.
地址 Stuttgart DE