| 发明名称 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | ||
| 摘要 | A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured. | ||
| 申请公布号 | US9637598(B2) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201414766433 | 申请日期 | 2014.02.03 |
| 申请人 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | 发明人 | Fujiwara Hiroaki;Kitai Yuki;Saito Hirosuke |
| 分类号 | C08L61/04;C08G73/22;C08J5/24;H01L23/29;H01L23/14;C08G73/02;C08K5/378;C08L79/04;H05K1/03;B32B15/14;C08L63/00;C08G14/06;C08L61/34;B32B15/08;B32B15/092;B32B27/04 | 主分类号 | C08L61/04 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A method of curing a thermosetting resin composition, comprising: preparing a thermosetting resin composition comprising a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound; and heating the thermosetting resin composition to be cured, wherein the thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound. | ||
| 地址 | Osaka JP | ||