Method of manufacturing a printed circuit board assembly sheet

摘要

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

主权项

1. A method of manufacturing a printed circuit board assembly sheet comprising a plurality of printed circuit boards, a support frame configured to integrally support the plurality of printed circuit boards such that the plurality of printed circuit boards are arranged at spacings, and a dummy trace portion provided in a region between at least one printed circuit board on one end side and the support frame, the method comprising the steps of:
forming first insulating layers, which correspond to the plurality of printed circuit boards and the dummy trace portion, on a support substrate; forming a plurality of conductor traces on each of the first insulating layers corresponding to the plurality of printed circuit boards and the first insulating layer corresponding to the dummy trace portion; and forming second insulating layers on the first insulating layers to cover the plurality of conductor traces corresponding to the plurality of printed circuit boards and the conductor trace corresponding to the dummy trace portion, respectively,
wherein each of the plurality of printed circuit boards is configured to be separated from the support frame, and the dummy trace portion is configured not to be separated from the support frame,wherein a groove is not formed in the first insulating layer in a region between adjacent conductor traces in the dummy trace portion, andwherein the step of forming the second insulating layers includes forming a groove in the second insulating layer in the region between the adjacent conductor traces in the dummy trace portion.