| 发明名称 | Light-emitting device package and light-emitting apparatus | ||
| 摘要 | A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit. | ||
| 申请公布号 | US9642196(B2) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201414189554 | 申请日期 | 2014.02.25 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Park In-soo;Son Min-young;Choi Myoung-soo |
| 分类号 | H05B33/08;H01L25/16;H01L23/00 | 主分类号 | H05B33/08 |
| 代理机构 | Muir Patent Law, PLLC | 代理人 | Muir Patent Law, PLLC |
| 主权项 | 1. A light-emitting device package comprising: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit. | ||
| 地址 | Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do KR | ||