Electrical contact structure with a redistribution layer connected to a stud

摘要

A semiconductor structure includes a silicon substrate, a protection layer, an electrical pad, an isolation layer, a redistribution layer, a conductive layer, a passivation layer, and a conductive structure. The silicon substrate has a concave region, a step structure, a tooth structure, a first surface, and a second surface opposite to the first surface. The step structure and the tooth structure surround the concave region. The step structure has a first oblique surface, a third surface, and a second oblique surface facing the concave region and connected in sequence. The protection layer is located on the first surface of the silicon substrate. The electrical pad is located in the protection layer and exposed through the concave region. The isolation layer is located on the first and second oblique surfaces, the second and third surfaces of the step structure, and the tooth structure.

主权项

1. A semiconductor structure, comprising:
a silicon substrate having a concave region, a step structure, a tooth structure, a first surface, and a second surface opposite to the first surface, wherein the step structure and the tooth structure surround the concave region, and the step structure has a first oblique surface, a third surface, and a second oblique surface facing the concave region and connected in sequence;wherein the tooth structure is substantially triangular in cross-section;
a protection layer located on the first surface of the silicon substrate and extending outward from a sidewall of the tooth structure, wherein the sidewall of the tooth structure faces away from the concave region; an electrical pad located in the protection layer and exposed through the concave region; an isolation layer located on the first and second oblique surfaces, the second and third surfaces of the step structure, and the tooth structure; a redistribution layer located on the isolation layer and the electrical pad; a conductive layer located on the redistribution layer; a passivation layer covering the step structure and the tooth structure and having an opening to expose the conductive layer, wherein the passivation layer covers the isolation layer that is on the sidewall of tooth structure and covers the protection layer that extends outward from the sidewall of the tooth structure; and a conductive structure located on the conductive layer in the opening of the passivation layer.