TFT array substrate and method for producing the same

摘要

A TFT array substrate has an organic insulating film formed of a photosensitive organic resin material. A common electrode and a lead-out wiring are formed on the organic insulating film, and a pixel electrode is formed above the common electrode with an interlayer insulating film provided between them. The pixel electrode is connected to the lead-out wiring through a contact hole formed in the interlayer insulating film. The lead-out wiring and the common electrode are connected to a drain electrode and a common wiring, respectively, through contact holes formed in the organic insulating film. A metal cap film is provided on each of the lead-out wiring and the common electrode in the contact holes formed in the organic insulating film.

主权项

1. A TFT array substrate comprising:
a TFT element; a common wiring supplied with a common potential; an organic insulating film formed of a photosensitive organic resin material to cover a drain electrode of said TFT element and said common wiring; a first contact hole formed in said organic insulating film, and reaching said drain electrode; a second contact hole formed in said organic insulating film, and reaching said common wiring; a first electrode and a lead-out wiring made of a transparent conductive film and extending on said organic insulating film; an interlayer insulating film formed on said first electrode; and a second electrode extending above said first electrode through said interlayer insulating film, and connected to said lead-out wiring through a third contact hole formed in said interlayer insulating film, wherein one of said first electrode and said lead-out wiring is connected to said drain electrode through said first contact hole, the other of said first electrode and said lead-out wiring is connected to said common wiring through said second contact hole, a metal cap film is formed directly on each of said first electrode and said lead-out wiring in said first contact hole and said second contact hole on respective sides facing away from said drain electrode and said common wiring, and said metal cap film is located so as to contact respective surfaces of said first electrode and said lead-out wiring all over a formation region of said metal cap film.