Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device

摘要

A surface-mount electronic device includes a body of semiconductor material, and a lead frame that includes a plurality of contact terminals. The plurality of contact terminals is electrically connected to the semiconductor body. The contact terminals are formed of sintered material.

主权项

1. A surface-mount electronic device, comprising:
a body of semiconductor material; an insulating layer having a planar and continuous top surface and a perimeter defined by side edges, at least one side edge including a plurality of lateral teeth delimiting adjacent recesses; and a lead frame including a plurality of contact terminals electrically connected to the body of semiconductor material, said contact terminals filling the recesses delimited by the plurality of lateral teeth and partially overlying the planar and continuous top surface of the insulating layer.