| 发明名称 | Laminated polishing pad and method for producing same | ||
| 摘要 | A method for manufacturing a laminated polishing pad of the present invention, comprising the steps of: forming a polishing layer by providing a light transmitting region in an opening A of a polishing region; providing an adhesive member X on one side of the polishing layer, wherein the adhesive member X contains a hot-melt adhesive; providing a removable protective member on a part of the adhesive member X corresponding to the light transmitting region; bonding a support layer to the adhesive member X on which the removable protective member is provided; and removing a part of the support layer corresponding to the light transmitting region and also removing the removable protective member to form an opening B. | ||
| 申请公布号 | US9636796(B2) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201314390959 | 申请日期 | 2013.02.28 |
| 申请人 | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 发明人 | Nakamura Kenji |
| 分类号 | B24B37/005;B24B37/22;B32B3/10;H01L21/306;B24B37/20;B24B37/013;B32B37/18;B32B38/10;B32B37/12;B32B38/00 | 主分类号 | B24B37/005 |
| 代理机构 | Law Office of Katsuhiro Arai | 代理人 | Law Office of Katsuhiro Arai |
| 主权项 | 1. A method for manufacturing a laminated polishing pad, comprising the steps of: forming a polishing layer by providing a light transmitting region in an opening A of a polishing region; providing an adhesive member X on one side of the polishing layer, wherein the adhesive member X contains a hot-melt adhesive; providing a removable protective member on a part of the adhesive member X corresponding to the light transmitting region; bonding a support layer to the adhesive member X on which the removable protective member is provided; and removing a part of the support layer corresponding to the light transmitting region and also removing the removable protective member to form an opening B. | ||
| 地址 | Newark DE US | ||