发明名称 LED lighting device and packaging method
摘要 The disclosure relates to a LED lighting device and a packaging method. The LED lighting device comprises a frame and at least one chip fixed in the frame, and further comprises a light emitting layer and a light condensing layer, wherein the light emitting layer wraps the chip, and the light condensing layer is arranged on the light emitting layer and configured for converging light passing through the light emitting layer.
申请公布号 US9640740(B2) 申请公布日期 2017.05.02
申请号 US201414498260 申请日期 2014.09.26
申请人 BOE TECHNOLOGY GROUP CO., LTD.;BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD. 发明人 Wang Tao
分类号 H01L33/58;H01L33/50 主分类号 H01L33/58
代理机构 Nath, Goldberg & Meyer 代理人 Nath, Goldberg & Meyer ;Goldberg Joshua B.;Thenor Leonid D.
主权项 1. A LED lighting device, comprising a frame and at least one chip fixed in the frame, and further comprising a light emitting layer and a light condensing layer, wherein the light emitting layer wraps the chip, and the light condensing layer is arranged on the light emitting layer and configured for converging light passing through the light emitting layer, wherein the light condensing layer has a shape of a convex lens, an upper surface and a lower surface of the light condensing layer are convexities, and an upper surface of the light emitting layer is a concave corresponding to the lower surface of the light condensing layer, wherein the light condensing layer is formed by a packaging adhesive, and the light emitting layer is prepared by mixing phosphor powder with the packaging adhesive, and wherein the light condensing layer includes the packaging adhesive only.
地址 Beijing CN