Multiple die stacking for two or more die

摘要

A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

主权项

1. A module, comprising:
first and second microelectronic elements, each microelectronic element having a front surface defining a plane, a plurality of element contacts at the front surface, and a plurality of edge surfaces extending away from the plane, the planes of the microelectronic elements being parallel to one another, the front surface of the second microelectronic element facing and partially overlying a rear surface of the first microelectronic element and attached thereto, the element contacts of the second microelectronic element projecting in a first direction beyond a first one of the edge surfaces of the first microelectronic element, first and second ones of the edge surfaces of the second microelectronic element extending in a second direction transverse to the first direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge surface, a second outer region adjacent the second edge surface, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edge surfaces, the element contacts of the second microelectronic element disposed in the central region beyond the first edge surface of the first microelectronic element; an encapsulation region overlying the edge surfaces of each microelectronic element, the encapsulation region having first and second major surfaces and an insertion surface extending between the major surfaces, the first and second major surfaces being parallel to the plane of each microelectronic element, the insertion surface being perpendicular to the plane of each microelectronic element; a lead assembly on at least the first major surface, the lead assembly having first and second opposed surfaces and first and second gaps extending between the first and second opposed surfaces; first wire bonds extending through the first gap and coupled to the element contacts of the first microelectronic element, and second wire bonds extending through the second gap and coupled to the element contacts of the second microelectronic element; and a plurality of module contacts adjacent the insertion surface, the module contacts comprising first surfaces of the lead assembly elements, the element contacts of the first and second microelectronic elements being electrically connected with the module contacts through the lead assembly and the first and second wire bonds.