发明名称 LED package with reflecting cup
摘要 The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.
申请公布号 US9640742(B2) 申请公布日期 2017.05.02
申请号 US201514826446 申请日期 2015.08.14
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 Lin Hou-Te;Chang Chao-Hsiung;Chen Pin-Chuan;Chen Lung-Hsin
分类号 H01L33/62;H01L33/38;H01L33/60;H01L33/48 主分类号 H01L33/62
代理机构 代理人 Reiss Steven
主权项 1. A light emitting diode (LED) package comprising: a plurality of electrodes; an LED die electrically connected with the plurality of electrodes; an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die, the casing comprising: a base; a reflecting cup extending upwards from the base upwards and surrounding the LED die; and a supporting portion being located inside the reflecting cup and across the electrodes; wherein the base comprises a frame and a plurality of brackets, and the brackets are formed inside the frame, the brackets comprise a first bracket, a second bracket, and a third bracket, the first bracket and the third bracket are spaced from each other, two ends of the first bracket are separately connected to the frame, two ends of the second bracket are also separately connected to the frame, and the second bracket is connected between the first bracket and the third bracket.
地址 Hsinchu Hsien TW