| 发明名称 | Sealless cooling device having manifold and turbulator | ||
| 摘要 | A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold. | ||
| 申请公布号 | US9638477(B1) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201514881588 | 申请日期 | 2015.10.13 |
| 申请人 | Caterpillar, Inc. | 发明人 | Choi Edward;Scolton Chris J.;Winkler John Walter |
| 分类号 | H05K7/20;F28F3/12;F28F13/12;B23P15/26;H01L23/473 | 主分类号 | H05K7/20 |
| 代理机构 | Finnegan, Henderson, Farabow, Garrett & Dunner, LLP | 代理人 | Finnegan, Henderson, Farabow, Garrett & Dunner, LLP |
| 主权项 | 1. A cooling device configured to be connected to an object having a surface, the cooling device comprising: a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes: a first side configured to be deposited directly onto the surface of the object;a cavity formed in the first side;an inlet channel fluidly connected to the cavity; andan outlet channel fluidly connected to the cavity; and a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold. | ||
| 地址 | Peoria IL US | ||