Insulating colloidal material and multilayer circuit structure

摘要

An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.

主权项

1. An insulating colloidal material, comprising:
a resin; selected from the group consisting of organometallic particles and ionic compounds, wherein a ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %, and an organic solvent, wherein
the organometallic particles comprise R-M-R′ or R-M-X, wherein R and R′ are each independently an alkyl group, aromatic hydrocarbon, cycloalkyl, haloalkane, a heterocyclic ring, or carboxylic acid, and a carbon number of at least one of R and R′ is 3 or more; M is selected from the group consisting of silver, palladium, copper, gold, tin, and iron, or a combination thereof; and X is a halogen compound or an amine;the ionic compound comprises CuCl2, Cu(NO3)2, CuSO4, Cu(OAc)2, AgCl, AgNO3, Ag2SO4, Ag(OAc), Pd(OAc), PdCl2, Pd(NO3)2, PdSO4, Pd(OAc)2, FeCl2, Fe(NO3)2, FeSO4, or [Fe3O(OAc)6(H2O)3]OAc.