| 发明名称 | Conduction cooling systems for linear accelerator cavities | ||
| 摘要 | A conduction cooling system for linear accelerator cavities. The system conducts heat from the cavities to a refrigeration unit using at least one cavity cooler interconnected with a cooling connector. The cavity cooler and cooling connector are both made from solid material having a very high thermal conductivity of approximately 1×104 W m−1 K−1 at temperatures of approximately 4 degrees K. This allows for very simple and effective conduction of waste heat from the linear accelerator cavities to the cavity cooler, along the cooling connector, and thence to the refrigeration unit. | ||
| 申请公布号 | US9642239(B2) | 申请公布日期 | 2017.05.02 |
| 申请号 | US201514689695 | 申请日期 | 2015.04.17 |
| 申请人 | Fermi Research Alliance, LLC | 发明人 | Kephart Robert |
| 分类号 | H05H7/22;H05H7/20 | 主分类号 | H05H7/22 |
| 代理机构 | Ortiz & Lopez, PLLC | 代理人 | Ortiz Luis M.;Lopez Kermit D.;Ortiz & Lopez, PLLC |
| 主权项 | 1. A conduction cooling system for at least one linear accelerator cavity, said system comprising: at least one cavity cooler operatively interconnecting said at least one linear accelerator cavity and a cooling connector, wherein said at least one cavity cooler and said cooling connector comprise a material having a thermal conductivity no lower than approximately 1×104 W m−1 K−1 at temperatures of approximately 4 degrees K; and a refrigeration source operatively connected to said cooling connector. | ||
| 地址 | Batavia IL | ||