发明名称 Method for molding a cable structure
摘要 A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. A movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. Gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.
申请公布号 US9640967(B2) 申请公布日期 2017.05.02
申请号 US201314059238 申请日期 2013.10.21
申请人 APPLE INC. 发明人 Aase Jonathan S.;Frazier Cameron P.;Thomas John E.
分类号 B29C45/14;H02G15/18;B29C39/42;B29C43/18;B29C43/20;B29C43/36;B29C33/10;B29K105/00;B29K705/00;B29L31/34 主分类号 B29C45/14
代理机构 Van Court & Aldridge LLP 代理人 Van Court & Aldridge LLP
主权项 1. A method for molding a cable structure, the method comprising: providing a length of a conductor bundle along a length of a mold, the mold comprising a center line; placing a first centering element of a plurality of centering elements at a first position about a periphery of the conductor bundle in a cross-section of the length of the conductor bundle, the cross-section being perpendicular to the center line; placing a second centering element of the plurality of centering elements at a second position about the periphery of the conductor bundle in the cross-section; and injecting material into the mold, wherein the plurality of centering elements is configured to center the cross-section of the conductor bundle on the center line of the mold during the injecting, and wherein at least one of the first centering element and the second centering element is configured to move along the length of the conductor bundle during the injecting.
地址 Cupertino CA US