Carrier, carrier leadframe, and light emitting device

摘要

A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

主权项

1. A light emitting device, comprising: a carrier; a light emitting diode (LED) chip carried within the carrier; and an encapsulant covering the LED chip, wherein the carrier comprises: at least one electrode portion, each of the at least one electrode portion comprising at least an electrode portion cross section; and a housing comprising a housing cross section, the housing at least partially covering the at least one electrode portion, wherein the housing cross section and the electrode portion cross section are not level with one another; wherein each of the at least one electrode portion further comprises a central area and two edge areas, and wherein the electrode portion cross section is located on at least one of the two edge areas; wherein the central area and the two edge areas protrude from the housing cross section; wherein the central area protrudes from the two edge areas.