Semiconductor chip, flip chip package and wafer level package including the same

摘要

A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first pad line and a second pad line. The semiconductor substrate may have an active face. The first central pad and the second central pad may be arranged on a central region of the active face. The first peripheral pad and the second peripheral pad may be arranged on an edge region of the active face. The first pad line may be connected between the first central pad and the first peripheral pad. The second pad line may be connected between the second central pad and the second peripheral pad.

主权项

1. A semiconductor chip comprising:
a semiconductor substrate having an active face; a first central pad and a second central pad arranged on a central region of the active face; a first peripheral pad and a second peripheral pad arranged on an edge region of the active face; a first pad line electrically connecting the first central pad with the first peripheral pad; a second pad line electrically connecting the second central pad with the second peripheral pad; and a passivation layer formed on the active face to cover the first pad line and the second pad line, the passivation layer having openings configured to expose the first central pad, the second central pad, the first peripheral pad and the second peripheral pad.