Semiconductor device including a clip

摘要

A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

主权项

1. A semiconductor device comprising:
a lead frame comprising a die paddle and a lead; a semiconductor chip having a first side and a second side opposite to the first side, the first side attached to the die paddle and the second side comprising a first bond pad and a second bond pad; a clip electrically coupling the first bond pad to the lead, the clip contacting the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defining a first cavity between a central portion of the first bond pad and the clip; solder within the first cavity electrically coupling the clip to the first bond pad; and a first opening to the first cavity defined by the clip, the first opening extending from an edge portion of the first bond pad other than the first edge portion, the first opening to route flux away from the second bond pad during reflow soldering.