Built-up lead frame package and method of making thereof

摘要

Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound, the die attach area having exposed areas to facilitate device die attachment thereon and the terminal I/O terminals providing connection to the device die bond pads; connection traces electrically couple the I/O terminals with one another, said connection traces having facilitated electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. An envelope of molding compound encapsulates the device die onto the built-up substrate lead frame.

主权项

1. A method for forming a semiconductor device in a leadless chip carrier (LCC) having a pre-plated and pre-molded lead frame assembly having an array of sub-assemblies each having a device die arranged thereon, the sub-assemblies having I/O terminals electrically connected to the device die, and the I/O terminals mutually connected to one another by connection traces, the method comprising:
encapsulating, in a molding compound, the device die arranged on the array of sub-assemblies of the pre-plated and pre-molded lead frame assembly; in a first direction in a series of parallel cuts, cutting through the molding compound covering the I/O terminals, to a depth, exposing un-plated vertical surfaces of the I/O terminals; electroplating the I/O terminals to form plated vertical surfaces; and in a second direction in a series of parallel cuts, the second direction angled with respect to the first direction, the second series of cuts extending through the lead frame assembly and molding compound and severing the connection traces, to singulate an individual LCC device from the lead frame assembly.