| 发明名称 |
COOLING ELEMENT FOR ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE |
| 摘要 |
A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces. |
| 申请公布号 |
US2017118868(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201615336046 |
申请日期 |
2016.10.27 |
| 申请人 |
ABB Technology Oy |
发明人 |
Seväkivi Pertti;Björkman Niko;Viljasalo Juha |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling element comprising a cooling body,
the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces. |
| 地址 |
Helsinki FI |
