发明名称 |
HEAT DISSIPATION STRUCTURE AND WATER BLOCK HAVING THE SAME |
摘要 |
A heat dissipation structure and water block having the same are provided in the present disclosure. The heat dissipation structure includes a vapor chamber and a heat dissipation component. A through opening is disposed on and through the vapor chamber, and the vapor chamber includes a heated surface. The heat dissipation component includes a base plate and multiple fins extended from the base plate, and the base plate includes a bottom surface. The heat dissipation component is configured corresponding to the through opening, and a coplanar structure is formed by the bottom surface and the heated surface. Heat conductive and heat dissipation performances of the heat dissipation structure and the water block are thereby improved. |
申请公布号 |
US2017115071(A1) |
申请公布日期 |
2017.04.27 |
申请号 |
US201514979850 |
申请日期 |
2015.12.28 |
申请人 |
TAIWAN MICROLOOPS CORP. |
发明人 |
LIN Chun-Hung |
分类号 |
F28D15/02;F28D15/04;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A heat dissipation structure, comprising:
a vapor chamber having a through opening disposed on and through the vapor chamber, the vapor chamber having a heated surface; and a heat dissipation component, comprising a base plate and a plurality of fins extended from the base plate, the base plate having a bottom surface, the heat dissipation component being arranged corresponding to the through opening, and a coplanar structure being formed by the bottom surface and the heated surface. |
地址 |
New Taipei City TW |