发明名称 HEAT DISSIPATION STRUCTURE AND WATER BLOCK HAVING THE SAME
摘要 A heat dissipation structure and water block having the same are provided in the present disclosure. The heat dissipation structure includes a vapor chamber and a heat dissipation component. A through opening is disposed on and through the vapor chamber, and the vapor chamber includes a heated surface. The heat dissipation component includes a base plate and multiple fins extended from the base plate, and the base plate includes a bottom surface. The heat dissipation component is configured corresponding to the through opening, and a coplanar structure is formed by the bottom surface and the heated surface. Heat conductive and heat dissipation performances of the heat dissipation structure and the water block are thereby improved.
申请公布号 US2017115071(A1) 申请公布日期 2017.04.27
申请号 US201514979850 申请日期 2015.12.28
申请人 TAIWAN MICROLOOPS CORP. 发明人 LIN Chun-Hung
分类号 F28D15/02;F28D15/04;H05K7/20 主分类号 F28D15/02
代理机构 代理人
主权项 1. A heat dissipation structure, comprising: a vapor chamber having a through opening disposed on and through the vapor chamber, the vapor chamber having a heated surface; and a heat dissipation component, comprising a base plate and a plurality of fins extended from the base plate, the base plate having a bottom surface, the heat dissipation component being arranged corresponding to the through opening, and a coplanar structure being formed by the bottom surface and the heated surface.
地址 New Taipei City TW
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