BOND HEAD ASSEMBLY AND SYSTEM

摘要

An inductive thermal bonding system includes at least one inductive bonding or heating member containing a magnetic E-shaped inductive core and a coil bounding a central member of the E-shaped inductive core. A rigid cover plate allows high and predictable temperature rate-of-change during use and reduced thermal cycling time without risk of detriment. Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability. A cooling system is provided for adaptively cooling both the bond head and the bonded stack. Single and paired inductive heating members may be employed, and may also be alternatively controlled and positioned to aid generation of multiplayer bonding subassemblies distant from an edge of a multiplayer sheet construct.

主权项

1. An inductive bonding system, comprising:
a controllable motion system for operating said inductive bonding system; at least one inductive bonding head member, said inductive head member further comprising:
an E-shaped ferrite core member having a central leg and two outer legs joined by a back member;at least a first coil member bounding said central leg and having a plurality of coil turns;a cover plate member on a contact surface of at least said central leg of said E-shaped ferrite core member and having a bonding surface opposite said contact surface during a use of said bonding system;at least one rigid core block means for bounding said E-shaped ferrite core member and said first coil member, and for supporting said cover plate member; anda temperature measurement means between said cover plate member and said E-shaped ferrite core member, whereby said ferrite core member and said coil member generate an inductive field during said use that is substantially split between said central leg and said two outer legs enabling a concentration of said field proximate said central leg for improved inductive bonding.