IN-SITU PACKAGING DECAPSULATION FEATURE FOR ELECTRICAL FAULT LOCALIZATION

摘要

An IR camera is used to image an IC to identify hot spots. The objective of the IR camera is removed and laser optics are inserted into the optical axis of the system. A laser is then used to ablate the encapsulation in a defined area around the optical axis. The IR camera operates in a lock-in mode to obtain phase information of the IR signal from the IC. The phase information is used to obtain a depth estimate of the defect. Predetermined etch rates are then used in conjunction with the depth estimate to generate a timed end-point for the laser ablation.

主权项

1. A system for testing and decapsulating IC, comprising:
a sample stage for supporting the IC; a thermal camera configured to detect location of hot spot caused by potential defect in the IC; a laser source of wavelength 400 nm to 900 nm; a first optics arrangement configured to enable the thermal camera to image the IC, the image being indicative of a location of a hot spot in the IC; a second optical arrangement configured to focus a laser beam from the laser source onto the IC; a scanner configured to generate a scanning motion between the laser beam and the IC so as to ablate a selected area of the IC.