发明名称 SOURCE/DRAIN FINFET CHANNEL STRESSOR STRUCTURE
摘要 A semiconductor structure includes a material stack of, from bottom to top, an insulator structure and a semiconductor fin portion located on a pedestal portion of a semiconductor substrate portion, wherein a doped epitaxial semiconductor material structure extends from each sidewall surface of the semiconductor fin portion, each doped epitaxial semiconductor material structure introduces a stress on the semiconductor fin portion. A gate structure straddles the semiconductor fin portion. A source-side stressor structure having a bottommost surface contacting a first subsurface of the semiconductor substrate portion and covering one of the doped epitaxial semiconductor material structure is located on a source-side of the gate structure. A drain-side stressor structure having a bottommost surface contacting a second subsurface of the semiconductor substrate portion and covering another of the doped epitaxial semiconductor material structure is located on a drain-side of the gate structure.
申请公布号 US2017117409(A1) 申请公布日期 2017.04.27
申请号 US201514921547 申请日期 2015.10.23
申请人 International Business Machines Corporation 发明人 Balakrishnan Karthik;Cheng Kangguo;Hashemi Pouya;Reznicek Alexander
分类号 H01L29/78;H01L29/66;H01L29/165 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor structure comprising: a material stack of, from bottom to top, an insulator structure and a semiconductor fin portion located on a pedestal portion of a semiconductor substrate portion, wherein a doped epitaxial semiconductor material structure extends from each sidewall surface of said semiconductor fin portion, each doped epitaxial semiconductor material structure introduces a stress on said semiconductor fin portion; a gate structure straddling said semiconductor fin portion; a source-side stressor structure contacting a first subsurface of said semiconductor substrate portion and covering one of said doped epitaxial semiconductor material structures located on a source-side of the gate structure; and a drain-side stressor structure contacting a second subsurface of said semiconductor substrate portion and covering another of said doped epitaxial semiconductor material structures located on a drain-side of the gate structure.
地址 Armonk NY US