发明名称 |
SOURCE/DRAIN FINFET CHANNEL STRESSOR STRUCTURE |
摘要 |
A semiconductor structure includes a material stack of, from bottom to top, an insulator structure and a semiconductor fin portion located on a pedestal portion of a semiconductor substrate portion, wherein a doped epitaxial semiconductor material structure extends from each sidewall surface of the semiconductor fin portion, each doped epitaxial semiconductor material structure introduces a stress on the semiconductor fin portion. A gate structure straddles the semiconductor fin portion. A source-side stressor structure having a bottommost surface contacting a first subsurface of the semiconductor substrate portion and covering one of the doped epitaxial semiconductor material structure is located on a source-side of the gate structure. A drain-side stressor structure having a bottommost surface contacting a second subsurface of the semiconductor substrate portion and covering another of the doped epitaxial semiconductor material structure is located on a drain-side of the gate structure. |
申请公布号 |
US2017117409(A1) |
申请公布日期 |
2017.04.27 |
申请号 |
US201514921547 |
申请日期 |
2015.10.23 |
申请人 |
International Business Machines Corporation |
发明人 |
Balakrishnan Karthik;Cheng Kangguo;Hashemi Pouya;Reznicek Alexander |
分类号 |
H01L29/78;H01L29/66;H01L29/165 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor structure comprising:
a material stack of, from bottom to top, an insulator structure and a semiconductor fin portion located on a pedestal portion of a semiconductor substrate portion, wherein a doped epitaxial semiconductor material structure extends from each sidewall surface of said semiconductor fin portion, each doped epitaxial semiconductor material structure introduces a stress on said semiconductor fin portion; a gate structure straddling said semiconductor fin portion; a source-side stressor structure contacting a first subsurface of said semiconductor substrate portion and covering one of said doped epitaxial semiconductor material structures located on a source-side of the gate structure; and a drain-side stressor structure contacting a second subsurface of said semiconductor substrate portion and covering another of said doped epitaxial semiconductor material structures located on a drain-side of the gate structure. |
地址 |
Armonk NY US |