STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A method may include providing a first semiconductor chip and a first insulating layer surrounding lateral sides of the first semiconductor chip; providing a second semiconductor chip and a second insulating layer surrounding lateral sides of the second semiconductor chip; providing a third insulating layer below the first semiconductor chip and first insulating layer, so that the first semiconductor chip is between the third insulating layer and the second semiconductor chip, the third insulating layer forming a package substrate; providing a plurality of external connection terminals on the third insulating layer, such that the third insulating layer has a first surface facing the first semiconductor chip and a second surface facing the external connection terminals; providing a first redistribution line on the first surface of the third insulating layer and extending horizontally along the first surface of the third insulating layer, the first redistribution line contacting a first conductive pad of the first semiconductor chip; and providing a second redistribution line connected to a second conductive pad at a surface of the second semiconductor chip, the second redistribution line passing through the first insulating layer to contact the first redistribution line.

主权项

1. A method, comprising:
providing a package substrate; providing external connection terminals on a bottom surface of the package substrate; providing a first semiconductor chip on a top surface of the package substrate, the first semiconductor chip having a bottom surface facing the package substrate and a top surface opposite the bottom surface, and having a first conductive pad at the bottom surface; providing a second semiconductor chip on the first semiconductor chip, the second semiconductor chip having a bottom surface facing the top surface of the first semiconductor chip and a top surface opposite the bottom surface, and having a second conductive pad at the bottom surface; providing an insulating layer surrounding outer side surfaces of the first semiconductor chip; providing a first redistribution line extending from the first conductive pad to a region laterally outside of the first semiconductor chip, the first redistribution line disposed on the top surface of the package substrate and on the bottom surface of the first semiconductor chip, the first redistribution extending horizontally; and providing a second redistribution line extending from the second conductive pad to the region laterally outside of the first semiconductor chip, the second redistribution line including a first portion extending from the second conductive pad to the region laterally outside of the first semiconductor chip and a second portion extending between the first portion and the first redistribution line, and extending horizontally and vertically between the first portion and the first redistribution line.