SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

摘要

A technique disclosed in the specification relates to a semiconductor device capable of minimizing restrictions on wire bonding activities and to a method for producing the semiconductor device. The semiconductor device of the present technique includes: a plurality of semiconductor chips disposed on a circuit pattern within a case defined by an outer frame in a plan view; and bonding wires for electrically connecting the semiconductor chips and the circuit pattern together. The semiconductor chips are arranged along a longer-side direction of the case. The bonding wires are strung along the longer-side direction of the case.

主权项

1. A semiconductor device comprising:
a plurality of semiconductor chips provided on a circuit pattern within a case defined by an outer frame in a plan view; bonding wires for electrically connecting said plurality of semiconductor chips and said circuit pattern together, and a main electrode provided within said case, wherein said plurality of semiconductor chips are arranged along a longer-side direction of said case, wherein said bonding wires are strung along the longer-side direction of said case, wherein said main electrode is disposed in a vicinity of one of sides extending in the longer-side direction of said case, and wherein said main electrode and said circuit pattern are connected together by ultra-sonic bonding, soldering, or brazing.