| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME |
| 摘要 |
Some embodiments of the present disclosure disclose a method for forming semiconductor packages. The method includes disposing a plurality of semiconductor chips over a top side of a wafer, molding the plurality of semiconductor chips with a first molding material, and after molding the semiconductor chips, forming a composite layer over the plurality of semiconductor chips. |
| 申请公布号 |
US2017117232(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201514923449 |
申请日期 |
2015.10.27 |
| 申请人 |
Inotera Memories, Inc. |
发明人 |
SHIH Shing-Yih;WU Tieh-Chiang |
| 分类号 |
H01L23/00;H01L23/538;H01L21/48;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for forming semiconductor packages comprising:
disposing a plurality of semiconductor chips over a top side of a wafer; molding the plurality of semiconductor chips with a first molding material; and after molding the semiconductor chips, forming a composite layer over the plurality of semiconductor chips. |
| 地址 |
Taoyuan City TW |
