| 发明名称 |
Thermal interface material having defined thermal, mechanical and electric properties |
| 摘要 |
An electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant, wherein the interface structure has a compressibility in a range between 1% and 20%, in particular in a range between 5% and 15%. |
| 申请公布号 |
US2017117208(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201615333993 |
申请日期 |
2016.10.25 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
KASZTELAN Christian;FUERGUT Edward;MENGEL Manfred;BRUCCHI Fabio;BASLER Thomas |
| 分类号 |
H01L23/373;H01L23/367;H01L23/495;H01L21/48;C08K3/38;C09K5/14;C08K3/22;C08K3/28;C08K3/34;H01L23/31;H01L21/56 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, the electronic component comprising:
an electrically conductive carrier; an electronic chip on the carrier; an encapsulant encapsulating part of the carrier and the electronic chip; an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant; wherein the interface structure has a compressibility in a range between 1% and 20%, in particular in a range between 5% and 15%. |
| 地址 |
Villach AT |
