SUBSTRATE PROCESSING DEVICE

摘要

In a substrate processing method, a substrate holding unit holds a substrate in a horizontal position, a processing liquid supplying unit supplies first and second processing liquids to the surface of the substrate held by the substrate holding unit, a substrate rotating unit rotates the substrate held by the substrate holding unit, a heater opposes the substrate held by the substrate holding unit, and a moving unit moves at least one of the substrate holding unit and the heater supporting member such that the heater and the substrate are held in two different relative positions.

主权项

1. A substrate processing method comprising:
a substrate holding step of holding a substrate by a substrate holding unit; a first arrangement step of placing a relative position of the substrate and a heater for heating the substrate to a first position; a first supply step of supplying a first processing liquid to the surface of the substrate in a state where the relative position of the substrate and the heater is the first position; a second arrangement step of changing the relative position between the substrate and the heater to a second position where an interval between the substrate and the heater is wider than in the first position; and a second supply step of supplying a second processing liquid different in type from the first processing liquid to the surface of the substrate in a state where the relative position of the substrate and the heater is the second position.