发明名称 |
SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING DEPOSITION APPARATUS |
摘要 |
Provided is a semiconductor manufacturing system having an increased process window for stably and flexibly performing a deposition process. The semiconductor manufacturing system includes a gas supply device functioning as a first electrode and including a plurality of injection holes, a reactor wall connected to the gas supply device, and a substrate accommodating device functioning as a second electrode, the substrate accommodating device and the reactor wall being configured to be sealed together via face sealing. A reaction gas supplied from the gas supply device toward the substrate accommodating device is discharged to the outside through a gas discharge path between the gas supply device and the reactor wall. The first electrode includes a protruded electrode adjacent to an edge of the gas supply device. |
申请公布号 |
US2017114460(A1) |
申请公布日期 |
2017.04.27 |
申请号 |
US201615087736 |
申请日期 |
2016.03.31 |
申请人 |
ASM IP Holding B.V. |
发明人 |
Kim Dae Youn;Kim Hie Chul;Jang Hyun Soo |
分类号 |
C23C16/455;C23C16/50;H01L21/02 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor manufacturing system comprising:
a gas supply device functioning as a first electrode and comprising a plurality of injection holes; a reactor wall connected to the gas supply device; and a substrate accommodating device functioning as a second electrode, the substrate accommodating device and the reactor wall being configured to be sealed via face sealing, wherein a reaction gas supplied from the gas supply device toward the substrate accommodating device is discharged to the outside through a gas discharge path between the gas supply device and the reactor wall, and wherein the first electrode comprises a protruded electrode adjacent to an edge of the gas supply device. |
地址 |
Almere NL |