发明名称 SOLID-STATE IMAGE SENSOR, ELECTRONIC APPARATUS, AND IMAGING METHOD
摘要 The present disclosure relates to a solid-state image sensor, an electronic apparatus and an imaging method by which specific processing other than normal processing can be sped up with reduced power consumption. The solid-state image sensor includes a pixel outputting a pixel signal used to construct an image and a logic circuit driving the pixel, and is configured of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together. In addition, among the plurality of pixels, a specific pixel is connected to the logic circuit independently of a normal pixel, the specific pixel being the pixel that outputs the pixel signal used in the specific processing other than imaging processing in which the image is imaged. The present technology can be applied to a stacked solid-state image sensor, for example.
申请公布号 US2017117310(A1) 申请公布日期 2017.04.27
申请号 US201515128629 申请日期 2015.03.17
申请人 Sony Corporation 发明人 TATANI Keiji;OGITA Tomoharu;NAGANO Takashi
分类号 H01L27/146;H04N5/374;H04N5/378;H04N5/232 主分类号 H01L27/146
代理机构 代理人
主权项 1. A solid-state image sensor comprising: a pixel outputting a pixel signal used to construct an image; and a logic circuit driving the pixel, wherein the solid-state image sensor is formed of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together, and a specific pixel among the plurality of the pixels is connected to the logic circuit independently of a normal pixel being the pixel other than the specific pixel, the specific pixel being the pixel that outputs the pixel signal used in specific processing other than imaging processing in which the image is imaged.
地址 Tokyo JP