CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL SHIELDING BETWEEN ELECTRONIC COMPONENTS

摘要

A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.

主权项

1. A module, comprising:
a circuit package, comprising:
a plurality of electronic components on a substrate;a molded compound disposed over the substrate and the plurality of electronic components; and an external shield disposed on at least one outer surface of the circuit package, the external shield being segmented into a plurality of external shield partitions that are grounded, respectively, adjacent external shield partitions of the plurality of external shield partitions being separated by a corresponding gap located between adjacent electronic components of the plurality of electronic components, wherein the external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress, and wherein each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.