SEMICONDUCTOR PACKAGE WITH INTEGRATED DIE PADDLES FOR POWER STAGE

摘要

In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control transistor having a drain attached to the first die paddle. The semiconductor package also includes a second conductive carrier attached to the first conductive carrier and including a second die paddle of the semiconductor package, and a sync transistor having a drain attached to the second die paddle. The second die paddle couples a source of the control transistor to the drain of the sync transistor.