发明名称 SEMICONDUCTOR PRESSURE SENSOR
摘要 In a semiconductor pressure sensor element, a first hydrogen permeation protection film is provided on a principal surface side of a first silicon substrate, and a second hydrogen permeation protection film is provided on a principal surface side of a second silicon substrate. The permeation paths of the hydrogen fluxes shown by the arrows A and B in FIG. 9 are blocked by the films. Also, a trench surrounding a reference pressure chamber is provided, and the first hydrogen permeation protection film and a third hydrogen permeation protection film are joined at the bottom portion of the trench, thereby blocking the permeation path of the hydrogen flux shown by the arrow C in FIG. 9. Furthermore, by providing a hydrogen storage chamber, hydrogen is trapped before the hydrogen reaches the reference pressure chamber.
申请公布号 US2017113917(A1) 申请公布日期 2017.04.27
申请号 US201615017733 申请日期 2016.02.08
申请人 Mitsubishi Electric Corporation 发明人 YOSHIKAWA Eiji
分类号 B81B3/00 主分类号 B81B3/00
代理机构 代理人
主权项 1. A semiconductor pressure sensor, comprising: a first silicon substrate having a diaphragm; a first hydrogen permeation protection film provided on the side of one principal surface of the first silicon substrate; a second silicon substrate, one principal surface of which having a depressed portion is joined to another principal surface of the first silicon substrate via an embedded oxide film; and a reference pressure chamber, the space of which, enclosed by the depressed portion and the other principal surface of the first silicon substrate, is brought into a vacuum state.
地址 Tokyo JP
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