发明名称 |
SEMICONDUCTOR PRESSURE SENSOR |
摘要 |
In a semiconductor pressure sensor element, a first hydrogen permeation protection film is provided on a principal surface side of a first silicon substrate, and a second hydrogen permeation protection film is provided on a principal surface side of a second silicon substrate. The permeation paths of the hydrogen fluxes shown by the arrows A and B in FIG. 9 are blocked by the films. Also, a trench surrounding a reference pressure chamber is provided, and the first hydrogen permeation protection film and a third hydrogen permeation protection film are joined at the bottom portion of the trench, thereby blocking the permeation path of the hydrogen flux shown by the arrow C in FIG. 9. Furthermore, by providing a hydrogen storage chamber, hydrogen is trapped before the hydrogen reaches the reference pressure chamber. |
申请公布号 |
US2017113917(A1) |
申请公布日期 |
2017.04.27 |
申请号 |
US201615017733 |
申请日期 |
2016.02.08 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
YOSHIKAWA Eiji |
分类号 |
B81B3/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor pressure sensor, comprising:
a first silicon substrate having a diaphragm; a first hydrogen permeation protection film provided on the side of one principal surface of the first silicon substrate; a second silicon substrate, one principal surface of which having a depressed portion is joined to another principal surface of the first silicon substrate via an embedded oxide film; and a reference pressure chamber, the space of which, enclosed by the depressed portion and the other principal surface of the first silicon substrate, is brought into a vacuum state. |
地址 |
Tokyo JP |