LC COMPOSITE COMPONENT

摘要

Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.

主权项

1. An LC composite component comprising:
a multi-layer substrate configured such that a plurality of insulating layers are stacked; a first pattern coil forming a coiled shape of which a first coil axis extends along a stacking direction of the multi-layer substrate, and including a coil conductor disposed between the plurality of insulating layers; and a chip capacitive element including a body made of a material different from that of the plurality of insulating layers, wherein all of the chip capacitive element is disposed within the coil conductor of the first pattern coil.