Methods, apparatus, and systems for contacting semiconductor dies that are electrically coupled to test access interface positioned in scribe lines of a wafer

摘要

A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed.

主权项

1. A device, comprising:
a first wafer having i) a first plurality of semiconductor dies, ii) a first plurality of scribe lines, each of the first plurality of scribe lines adjacent one or more of the first plurality of semiconductor dies, iii) a first test access interface positioned in one or more of the first plurality of scribe lines, the first test access interface having a first plurality of through-substrate conductors with a standardized physical layout, wherein the through-substrate conductors comprise a ground line and a signal line, and iv) electrical couplings between at least some of the first plurality of through-substrate conductors and at least one of the first plurality of semiconductor dies.