发明名称 Liquid-assisted bottom air cooling of electronic racks in data centers
摘要 A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
申请公布号 US9635785(B1) 申请公布日期 2017.04.25
申请号 US201514936177 申请日期 2015.11.09
申请人 BAIDU USA LLC 发明人 Heydari Ali;Kumar Eric Mahendra;Ingalz Charles J.;Lu Weiyu;Gao Tianyi;Sahini Manasa;Cui Yan
分类号 G06F1/16;H05K5/00;H05K7/00;H05K7/20 主分类号 G06F1/16
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. A data center system, comprising: a container to contain a plurality of electronic racks of information technology (IT) components operating therein; and a cooling unit having one or more cooling modules disposed underneath the electronic racks of the IT components to receive first liquid from a chiller unit, to exchange heat generated from the IT components using the first liquid, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the chiller unit, wherein each of the electronic racks comprises a housing to house one or more of the IT components arranged in a stack,a first rack aisle formed on a first side of the one or more IT components to direct cool air received from the cooling unit upwardly, anda second rack aisle formed on a second side of the one or more IT components to direct hot air to the cooling unit downwardly, the hot air being transformed from the cool air from the first rack aisle by flowing through an air space between the one or more IT components.
地址 Sunnyvale CA US
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