0204 shifted vias with merge pads

摘要

A printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is disclosed. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array provides component landing pads sized to accommodate an 0204 surface mount component within a 1.2 mm by 1.0 mm rectangular spacing. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is particularly useful for overcoming the problem of component placement on tight-pitch arrays known in the art.

主权项

1. A printed circuit board (PCB) comprising:
a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a tight-pitch grid pattern; a set of four of vias, on an opposite side of the PCB from the BGA, spaced in a rectangular arrangement of dimensions 1.2 mm by 1.0 mm that is different from the tight-pitch grid pattern; two diagonally opposite of said set of four vias having respective component landing pads; a solder mask covering the component landing pads with respective openings for each of the set of four vias; a solder pad within each said opening electrically connected respectively to each said component landing pad; and a two-lead component attached to each solder pad.