Image sensor chip sidewall interconnection

摘要

An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

主权项

1. An image sensor chip comprising:
a substrate supporting an integrated circuit (IC) configured to sense incident light; a lateral recess extending laterally into the substrate, continuously from an outermost sidewall of the substrate to a recessed sidewall of the substrate; a sidewall interconnect structure electrically coupled with the IC, wherein the sidewall interconnect structure comprises a first segment and a second segment both arranged in the lateral recess, and wherein the first segment extends along the recessed sidewall and the second segment extends laterally from the first segment to the outermost sidewall; and a through semiconductor via (TSV) extending through the substrate to the IC and configured to electrically couple the sidewall interconnect structure to the IC.