Pattern outline extraction device, pattern outline extraction method, and computer program product

摘要

According to one embodiment, a pattern outline extraction device includes a control unit, a secondary storage unit and a memory. The control unit reads the image data of the patterns formed by changing the process condition, and extracts outlines of the patterns from the image data. The control unit superposes the outlines, and sets straight measurement lines. The control unit calculates variations on the measurement lines relative to measurement points on the measurement lines at points of intersection of the measurement lines and the outlines, and calculates variation-process condition correspondence information. The control unit calculates predicted variations on the measurement lines relative to the measurement points corresponding to a desired process condition based on the variation-process condition correspondence information, calculates calculated points that are obtained by adding the predicted variations to the measurement points on the measurement lines, and calculates a predicted outline by connecting the calculated points.

主权项

1. A pattern outline extraction device comprising:
a control unit including at least a central processing unit and a peripheral circuit that calculates a predicted outline of a pattern acquired under a desired process condition by use of image data of patterns formed by changing a process condition; a non-volatile memory device that stores a program and data executed by the control unit; and a memory that temporarily stores the program and the data stored in the non-volatile memory device to be executed by the control unit, wherein the control unit in analyzing semiconductor circuit pattern: reads the image data of the patterns formed by changing the process condition, extracts outlines of the patterns from the image data formed under the process condition, superposes the outlines, sets measurement lines intersecting with the outlines being superposed, calculates variations on the measurement lines relative to measurement points on the measurement lines at points of intersection of the measurement lines and the outlines, calculates variation-process condition correspondence information indicating a relationship between the process conditions and the variations for the measurement lines, calculates predicted variations on the measurement lines relative to the measurement points corresponding to a desired process condition based on the variation-process condition correspondence information, calculates calculated points that are obtained by adding the predicted variations to the measurement points on the measurement lines for the measurement lines, and calculates a predicted outline by connecting the calculated points.